Description
The multifield coupled smart materials (MCSM), such as piezoelectric and magnetoelectroelastic materials, are increasingly attracting more attention in a wide range of advanced engineering applications because of the coupling effects among the mechanical, electric, and magnetic fields. Because the capability of converting energy from one to the other among different physical fields, MCSM offer many challenging opportunities for engineers to design and apply novel intelligent devices and structures such as transducers, sensors, actuators, lasers, supersonics, etc., which are capable of responding to internal or environmental changes. Imperfections, defects in MCSM are unavoidable, for instance, during the manufacturing process. They may significantly affect the performance of the structures and are primary sources that not only result in damage and failure of the structures, but also disturb energetic exchanges of transmitted information in the process among the physical fields. In this study, transient dynamic analysis of stationary cracks in homogeneous and linear MCSM (e.g., piezoelectric and magnetoelectroelastic) solids under impact loading is presented. A dynamic extended finite element method is developed using the asymptotic basis functions particularly suitable for cracks in piezoelectric and magnetoelectroelastic materials to properly describe the singular fields at the crack-tips in such materials. The generalized dynamic intensity factors are computed using the interaction integrals taking the inertial effect into account and the asymptotic crack-tip fields in MCSM materials. Comparisons of the present numerical results with the reference solutions available in literature show very good agreements.
Recommended Citation
BUI, T. (2014). XFEM based transient dynamic fracture analysis in multifield coupled smart materials. In A. Bajaj, P. Zavattieri, M. Koslowski, & T. Siegmund (Eds.). Proceedings of the Society of Engineering Science 51st Annual Technical Meeting, October 1-3, 2014 , West Lafayette: Purdue University Libraries Scholarly Publishing Services, 2014. https://docs.lib.purdue.edu/ses2014/mss/issues/13
XFEM based transient dynamic fracture analysis in multifield coupled smart materials
The multifield coupled smart materials (MCSM), such as piezoelectric and magnetoelectroelastic materials, are increasingly attracting more attention in a wide range of advanced engineering applications because of the coupling effects among the mechanical, electric, and magnetic fields. Because the capability of converting energy from one to the other among different physical fields, MCSM offer many challenging opportunities for engineers to design and apply novel intelligent devices and structures such as transducers, sensors, actuators, lasers, supersonics, etc., which are capable of responding to internal or environmental changes. Imperfections, defects in MCSM are unavoidable, for instance, during the manufacturing process. They may significantly affect the performance of the structures and are primary sources that not only result in damage and failure of the structures, but also disturb energetic exchanges of transmitted information in the process among the physical fields. In this study, transient dynamic analysis of stationary cracks in homogeneous and linear MCSM (e.g., piezoelectric and magnetoelectroelastic) solids under impact loading is presented. A dynamic extended finite element method is developed using the asymptotic basis functions particularly suitable for cracks in piezoelectric and magnetoelectroelastic materials to properly describe the singular fields at the crack-tips in such materials. The generalized dynamic intensity factors are computed using the interaction integrals taking the inertial effect into account and the asymptotic crack-tip fields in MCSM materials. Comparisons of the present numerical results with the reference solutions available in literature show very good agreements.