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A finite deformation coupled plastic-damage model for simulating fracture of metal foams Hao Pan, Masdar Institute of Science and Technology, United Arab Emirates |
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A general cohesive continuum mechanics framework for constitutive modeling of microdamage healing Ammar Alsheghri, Masdar Institute of Science and Technology, United Arab Emirates |
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Cavitation in rubber: an elastic instability or a fracture phenomenon? Victor Lefevre, University of Illinois at Urbana-Champaign, United States |
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Daniel Spring, University of Illinois at Urbana Champaign, United States |
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Conjugate-directions meshes for cohesive element models: the three-dimensional case Julian J. Rimoli, Georgia Institute of Technology |
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Designing electrically tougher materials Wei Hong, Iowa State University |
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Effect of overweight trucks and natural conditions on the durability of concrete bridges Boyuan Liu, Purdue University |
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Effect of viscoplasticity in HMX grains on ignition probability of dynamically loaded PBXs David Barrett Hardin, Georgia Institute of Technology, United States |
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Extraction of rate-dependent traction–separation relations Kenneth Liechti, University of Texas at Austin, United States |
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Matthew Mosby, University of Notre Dame, United States |
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High fidelity model of a hook and loop fastener Vanessa Restrepo, Lyles School of Civil Engineering, Purdue University, West Lafayette, IN, United States |
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Local versus homogenized field yield criterion for failure in amorphous polymers Yuesong Xie, Purdue University, United States |
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Yousung Han, Purdue University, West Lafayette, United States |
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Joselito Wong, Purdue University, United States |
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Ali Ghahremaninezhad, University of Miami |
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Nonlocal regularization for loss of ellipticity in inelastic problems Alejandro Mota, Sandia National Laboratories, United States |
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Can Xu, University of Houston |
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Resolving the evolution of pore structures in 304-L laser welds James Foulk, Sandia National Laboratories |
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Simulation of the microlevel damage evolution in polymer matrix composites Masoud Safdari, University of Illinois, United States |
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Hongsuk Lee, Purdue University West Lafayette, United States |
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Glaucio Paulino, University of Illinois at Urbana-Champaign |
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XFEM based transient dynamic fracture analysis in multifield coupled smart materials TINH QUOC BUI, Tokyo Institute of Technology |