Abstract

With silicon CMOS technology approaching the scaling limit, alternating channel materials and novel device structures have been extensively studied and attracted a lot of attention in solid-state device research. In this dissertation, solid-state electron devices for post-Si CMOS applications are explored including both new materials such as III-V and 2D materials and new device structures such as tunneling field-effect transistors and negative capacitance field-effect transistors. Multiple critical challenges in applying such new materials and new device structures are addressed and the key achievements in this dissertation are summarized as follows: 1) Development of fabrication process technology for ultra-scaled planar and 3D InGaAs MOSFETs. 2) Interface passivation by forming gas anneal on InGaAs gate-all-around MOSFETs. 3) Characterization methods for ultra-scaled MOSFETs, including a correction to subthreshold method and low frequency noise characterization in short channel devices. 4) Development of short channel InGaAs planar and 3D gate-allaround tunneling field-effect transistors. 5) Negative capacitance field-effect transistors with hysteresis-free and bi-directional sub-thermionic subthreshold slope and the integration with various channel materials such as InGaAs and MoS2.

Degree Type

Dissertation

Degree Name

Doctor of Philosophy (PhD)

Department

Electrical and Computer Engineering

Committee Chair

Peide Ye

Date of Award

8-2018

Committee Member 1

Mark S. Lundstrom

Committee Member 2

Joerg Appenzeller

Committee Member 3

Zhihong Chen

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