The CTRC is a graduated National Science Foundation Industry/University Cooperative Research Center, and addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces. The agenda for the Center is set on a yearly basis with research projects identified through a ranking by all members. Regular updates on the work are made available to members through a restricted-access web page. The Center meets twice a year to review progress and choose upcoming projects.

One of the distinctive features of CTRC is that the research agenda is set by the members—each member has a strong input in the research directions adopted. Since members are from diverse industries, beneficial cross-industry interactions are common. A product-oriented focus is maintained. Equipment manufacturers are included amongst the participants, and this facilitates a translation of research ideas and prototypes into products.

Link to the Cooling Technologies Research Center Web site

The following collection of documents represents research from the Cooling Technologies Research Center in addition to related work published by its faculty and students.

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Manuscripts from 2007

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Experimental investigation of steady buoyant-thermocapillaryconvection near an evaporating meniscus, H. K. Dhavaleswarapu, Pramod Chamarthy, S V. Garimella, and Jayathy Y. Murthy

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Ionic Winds for Locally Enhanced Cooling, David B. Go, S V. Garimella, Timothy Fisher, and R. K. Mongia

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Heat and Mass Transport in Heat Pipe Wick Structures, B. D. Iverson, T. W. Davis, S V. Garimella, M. T. North, and S. Kang

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Local Heat Transfer Coefficients Under Flows Induced by Vibrating Cantilevers, M. Kimber and S V. Garimella

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Local Heat Transfer Coefficients Induced by Piezoelectrically Actuated Vibrating Cantilevers, M. Kimber, S V. Garimella, and A. Raman

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Towards a Thermal Moore’s Law, Shankar Krishnan, S V. Garimella, Gregory M. Chrysler, and Ravi V. Mahajan

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Analysis of Solid-Liquid Phase Change under Pulsed Heating, S. Krishnan, J. Y. Murthy, and S V. Garimella

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Flow Boiling Heat Transfer in Microchannels, D. Liu and S V. Garimella

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Induction electrohydrodynamics micropump forhigh heat flux cooling, Vishal Singhal and S V. Garimella

Analysis of Gap Formation in the Casting of Energetic Materials, D. Sun, S. R. Annapragada, S V. Garimella, and S. K. Singh

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Numerical and Experimental Investigation of Solidification Shrinkage, D. Sun and S V. Garimella

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Piezoelectric Fans using Higher Flexural Modes for Electronics Cooling Applications, Sydney M. Wait, Sudipta Basak, S V. Garimella, and Arvind Raman

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Characteristics of an Evaporating Thin Film in a Microchannel, Hao Wang, S V. Garimella, and Jayathy Y. Murthy

Manuscripts from 2006

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Energy-Based Model for Electrowetting-Induced Droplet Actuation, V. Bahadur and S V. Garimella

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Hydrodynamic Loading of Microcantilevers Vibrating in Viscous Fluids, Sudipta Basak, Arvind Raman, and S V. Garimella

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Characterization of Rough Engineering Surfaces for Use in Thermal Contact Conductance Modeling, A. F. Black and S V. Garimella

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Measurements and high-speed visualizations of flow boilingof a dielectric fluid in a silicon microchannel heat sink, Tailian Chen and S V. Garimella

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Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink, T. Chen and S V. Garimella

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Subcooled Boiling Incipience on a Highly Smooth Microheater, T. Chen, J. F. Klausner, S V. Garimella, and J. N. Chung

On-Chip Thermal ManagementWith Microchannel Heat Sinksand Integrated Micropumps, S V. Garimella, Vishal Singhal, and Dong Liu

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Experimental and Numerical Investigation of Melting in a Cylinder, B Jones, D Sun, S Krishnan, and S V. Garimella

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Direct Simulation of Transport in Open-Cell Metal Foams, S. Krishnan, J. Y. Murthy, and S V. Garimella

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Thermally Developing Flow and Heat Transfer in Rectangular Microchannels of Different Aspect Ratios, Poh-Seng Lee and S V. Garimella

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Analysis and Prediction of Constriction Resistance between Coated Surfaces, C. T. Merril and S V. Garimella

Performance Analysis of a Miniature-Scale Vapor Compression System For Electronics Cooling: Bread Board Setup, S. Trutassanawin, L. Cremaschi, E. A. Groll, and Suresh V. Garimella

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Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling, S. Trutassanawin, E. A. Groll, S V. Garimella, and L Cremaschi

Experimental Investigation of a Miniature-ScaleRefrigeration System for Electronics Cooling, Suwat Trutassanawin, Eckhard A. Groll, S V. Garimella, and Lorenzo Cremaschi

Microbubble Return Phenomena During Subcooled Boiling on Small Wires, H Wang, X. F. Peng, S V. Garimella, and D. Christopher

Manuscripts from 2005

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Dynamic Response Optimization of Piezoelectrically Excited Thin Resonant Beams, S. Basak, A. Raman, and S V. Garimella

Subcooled boiling incipience on a highly smooth microheater, Tailian Chen, James F. Klausner, S V. Garimella, and Jacob N. Chung

Advances In Mesoscale Thermal Management Technologies for Microelectronics, S V. Garimella

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A Novel Hybrid Heat Sink using Phase Change Materials for Transient Thermal Management of Electronics, Shankar Krishnan, S V. Garimella, and S. S. Kang

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A Two-Temperature Model for Solid/Liquid Phase Change in Metal Foams, S. Krishnan, J. Y. Murthy, and S V. Garimella

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Investigation of Heat Transfer in Rectangular Microchannels, Poh-Seng Lee, S V. Garimella, and Dong Liu

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Nucleate Boiling in Microchannels, D. Liu, P.S. Lee, and S V. Garimella

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Analysis and Optimization of the Thermal Performance of Microchannel Heat Sinks, Dong Liu and S V. Garimella

Analysis and optimizationof the thermal performance ofmicrochannel heat sinks, Dong Liu and S V. Garimella

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Infrared Micro-Particle Image Velocimetry Measurement in Silicon-Based Microdevices, Dong Liu, S V. Garimella, and Steve Wereley

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Prediction of the Onset of Nucleate Boiling in Microchannel Flow, Dong Liu, Poh-Seng Lee, and S V. Garimella

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Low-Voltage Ionization of Air with Carbon-Based Materials, M. S. Peterson, W. Zhang, T. S. Fisher, and S V. Garimella

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Influence of Bulk Fluid Velocity on the Efficiency of Electrohydrodynamic Pumping, V. Singhal and S V. Garimella

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A Novel Valveless Micropump WithElectrohydrodynamic Enhancement for HighHeat Flux Cooling, Vishal Singhal and S V. Garimella

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An Experimentally Validated Thermo-mechanical Model for the Prediction of Thermal Contact Conductance, Vishal Singhal, Paul J. Litke, Anthony F. Black, and S V. Garimella

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Jet Flows around Microbubbles in Subcooled Boiling, H. Wang, X. F. Peng, D. M. Christopher, and S V. Garimella

Manuscripts from 2004

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Experimental Investigation of the Thermal Performance of Piezoelectric Fans, Tolga Acikalin, Sydney M. Wait, S V. Garimella, and Arvind Raman

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Analysis and Prediction of Constriction Resistance for Contact Between Rough Engineering Surfaces, A. F. Black, V. Singhal, and S V. Garimella

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Single-Phase Flow and Heat Transport and Pumping Considerations in Microchannel Heat Sinks, S V. Garimella and Vishal Singhal

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Analysis of a Phase Change Energy Storage System for Pulsed Power Dissipation, S Krishnan and S V. Garimella

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Thermal Management of Transient Power Spikes in Electronics - Phase Change Energy Storage or Copper Heat Sinks?, S. Krishnan and S V. Garimella

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A Two-Temperature Model for the Analysis of Passive Thermal Control Systems, S. Krishnan, J. Y. Murthy, and S V. Garimella

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Investigation of Liquid Flow in Microchannels, D. Liu and S V. Garimella

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Microscale Pumping Technologies for Microchannel Cooling Systems, V. Singhal, S V. Garimella, and A. Raman

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Low Reynolds Number Flow Through Nozzle-Diffuser Elements in Valveless Micropumps, Vishal Singhal, Jayathi Y. Murthy, and S V. Garimella

Optimization of Thermal Interface Materials forElectronics Cooling Applications, Vishal Singhal, Thomas Siegmund, and S V. Garimella

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Optimization of Thermal Interface Materials for Electronics Cooling Applications, V. Singhal, Thomas Siegmund, and Suresh V. Garimella

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Transport in Flat Heat Pipes at High Heat Fluxes from Multiple Discrete Sources, U. Vadakkan, S V. Garimella, and J. Y. Murthy

Simulation of ion generation and breakdown in atmospheric air, W. Zhang, T. S. Fisher, and S V. Garimella

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Simulation of Ion Generation and Breakdown in Atmospheric Air, W. Zhang, T. S. Fisher, and S V. Garimella

Manuscripts from 2002

Contributions from Thermal Challenges inNext Generation Electronic Systems (THERMES), S V. Garimella and Yogendra K. Joshi

Thermal Challenges in Next Generation ElectronicSystems- Summary of Panel Presentations andDiscussions, S V. Garimella, Yogendra K. Joshi, Avram Bar-Cohen, Ravi Mahajan, K. C. Toh, V. P. Carey, M. Baelmans, J. Lohan, B. Sammakia, and F. Andros

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Concentration Fields in the Solidification Processing of Metal Matrix Composites, B Moussa, J E. Simpson, and S V. Garimella

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Modeling of Constriction Resistance in Coated Joints, E. L. Olsen, S V. Garimella, and C. V. Madhusudana

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An Experimental and Numerical Investigation of the Bridgman Growth of a Transparent Material, J E. Simpson, S V. Garimella, and H C. de Groh III

Manuscripts from 1999

Experimental Optimization of Confined Air Jet Impingement on a Pin Fin Heat Sink, L. A. Brignoni and S V. Garimella

The Development of a Bubble Rising in a Viscous Liquid, L. Chen, S V. Garimella, J. A. Reizes, and E. Leonardi

Fiber-Spacing Effects in the Solidification Processing of Metal Matrix Composites, M M. Guslick, J E. Simpson, and S V. Garimella

Manuscripts from 1997

Motion of Interacting Gas Bubbles in a Viscous Liquid Including Wall-Effects and Evaporation, L. Chen, S V. Garimella, J. A. Reizes, and E. Leonardi

Composite Correlations for Convective Heat Transfer from Arrays of Three-Dimensional Obstacles, Garron K. Morris and S V. Garimella

Manuscripts from 1996

Nozzle-Geometry Effects in Liquid Jet Impingement Heat Transfer, S V. Garimella and Boris Nenaydykh

Thermal Wake Downstream of a Three-Dimensional Obstacle, Garron K. Morris and S V. Garimella

Manuscripts from 1994

Nonlinear Interface Stability Analysis of Alloy Solidification Including Effects of Surface Energy, Lei Z. Schlitz and S V. Garimella

Manuscripts from 1993

A Modified Mullins-Sekerka Stability Analysis Including Surface Energy Effects, Lei Zhang and S V. Garimella