Abstract
To enhance the dryout heat flux of vapor chambers over a 1 cm × 1 cm area, this study describes the testing of four different vapor chamber design architectures (each having an overall size of 50 mm × 50 mm × 5.5 mm). The designs leverage a combination of internal liquid feeding posts and evaporator vapor venting features to improve the capillary-fed boiling performance. The study provides systematic insight into increasing the dryout limit of a vapor chamber and lowering the thermal resistance by assessing the effect of each geometric feature independently. A jet impingement air cooling test facility is used to measure the total thermal resistance of the package in a representative application, while a liquid cooling test facility is used to measure the thermal resistance of the vapor chamber itself. The results show that a vapor chamber with a combination of machined posts coated with sintered wick and vapor vent features has superior performance over vapor chambers with independent features. It dissipated the highest heat flux of 589 W/cm2 and provided the lowest total package thermal resistance of 0.28 K/W for a 1 cm2 heat input area. The performance improvements are attributed to an improved liquid supply utilizing the porous-wick-coated machined posts and a reduction vapor egress pressure utilizing the vent features above the heater area.
Keywords
Heat spreader, Vapor chamber, Electronics cooling
Date of this Version
2024
Published in:
D.J. Lohan, S.N. Joshi, E.M. Dede, S. Sudhakar, and J.A. Weibel, Experimental investigation of post and vented vapor chamber designs for high heat flux dissipation, International Journal of Heat and Mass Transfer 222, p. 125116, 2024.
Link to original published article:
https://doi.org/10.1016/j.ijheatmasstransfer.2023.125116
Comments
This is the publisher PDF of D.J. Lohan, S.N. Joshi, E.M. Dede, S. Sudhakar, and J.A. Weibel, Experimental investigation of post and vented vapor chamber designs for high heat flux dissipation, International Journal of Heat and Mass Transfer 222, p. 125116, 2024. Published CC-BY-NC-ND, the version of record is also available at DOI: 10.1016/j.ijheatmasstransfer.2023.125116.