Abstract

The heat transfer and hydraulic performance of a flat evaporator, pump-assisted capillary loop cooler is evaluated for a 1 cm2 heat source. The cooler consists of a copper manifold that houses a compensation chamber that feeds liquid to a sintered, flat evaporator wick below via a micro-tube array. Liquid evaporates from the copper wick as it is attached to the heater through a copper base plate. The custom cooler design offers separate flow routes for liquid and vapor phases during steady operation and thereby maintaining the pressure balance of the flow loop. The cooler performance is evaluated using de-ionized water as the coolant with an inlet volumetric flowrate of 322 ml/min. The cooler achieves a steady convective heat transfer coefficient of >95 kW/m2 K with 537] to [356, >610] W/cm2 within the same temperature range. Such a cooler shows promise for systems of variable thermal load where system pressure is a key consideration.

Comments

This is the publisher PDF of D.J. Lohan, B. Sarma, S.N. Joshi, E.M. Dede, A. Soto, S. Sudhakar, and J.A. Weibel, Thermal performance of a pump-assisted capillary cooler, ASME Thermal Science and Engineering Applications, TSEA-23-1499, 2024. Published CC-BY, the version of record is at DOI: 10.1115/1.4065619.

Keywords

capillary pumped loop, pump-assisted cooling, high heat flux, evaporator, electronics thermal management, capillary-fed boiling, two-phase flow, electronic cooling, evaporation, porous media, two-phase flow and heat transfer

Date of this Version

2024

Published in:

D.J. Lohan, B. Sarma, S.N. Joshi, E.M. Dede, A. Soto, S. Sudhakar, and J.A. Weibel, Thermal performance of a pump-assisted capillary cooler, ASME Thermal Science and Engineering Applications, TSEA-23-1499, 2024.

Included in

Engineering Commons

COinS