A transient resistance/capacitance network-based model for heat spreading in substrate stacks having multiple anisotropic layers

Authors

S. Bandyopadhyay
Justin WeibelFollow

Date of this Version

3-1-2023

DOI

https://doi.org/10.1115/1.4055987

Published in:

S. Bandyopadhyay and J.A. Weibel, A transient resistance/capacitance network-based model for heat spreading in substrate stacks having multiple anisotropic layers, ASME Journal of Electronic Packaging 145(2), p. 021009, 2023.