Date of this Version
3-1-2023
DOI
https://doi.org/10.1109/TCPMT.2022.3230044
Published in:
S. Bandyopadhyay, A. Yuksel, A.M. Marconnet, J.A. Weibel, Intra-lid multi-core vapor chamber architecture for heterogeneous electronic packages: technology concept to prototype evaluation, IEEE Transactions on Components Packaging and Manufacturing Technology 12, pp.1932-1938, 2022.
COinS