Description

The speaker presents a new micromanufacturing route, termed “micro-masonry” for multismall volume rapid fabrication of MEMS structures and devices. This approach involves a transfer printing-based assembly of micro/nanoscale materials, optionally, in conjunction with material bonding techniques relying on rapid thermal annealing. The discussion starts with the current state-of-the-art of transfer printing via advanced polymer stamps which exhibit exceptional reversible dry adhesion. Subsequently, the procedures of the preparation, assembly, and bonding of three major materials in MEMS such as silicon, silicon dioxide, and gold are introduced. Finally, several system level applications including imbricate photonic scales, vertical hidden comb drives, MEMS scanners, and MEMS resonators built by micro-masonry are demonstrated. The strategies shown in this work will elevate the manufacture of microsystems toward 3D, flexible, and rapid production.

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Micro-masonry (for multismall volume rapid fabrication)

The speaker presents a new micromanufacturing route, termed “micro-masonry” for multismall volume rapid fabrication of MEMS structures and devices. This approach involves a transfer printing-based assembly of micro/nanoscale materials, optionally, in conjunction with material bonding techniques relying on rapid thermal annealing. The discussion starts with the current state-of-the-art of transfer printing via advanced polymer stamps which exhibit exceptional reversible dry adhesion. Subsequently, the procedures of the preparation, assembly, and bonding of three major materials in MEMS such as silicon, silicon dioxide, and gold are introduced. Finally, several system level applications including imbricate photonic scales, vertical hidden comb drives, MEMS scanners, and MEMS resonators built by micro-masonry are demonstrated. The strategies shown in this work will elevate the manufacture of microsystems toward 3D, flexible, and rapid production.