Abstract
The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickness, are under investigation as a potential solution for the closest operation points to the beams, where the radiation fluence is estimated to reach 10(16) n(eq)/Tcm(2). Two different 3D detector designs with CMS pixel readout electronics are being developed and evaluated for their advantages and drawbacks. The fabrication of full-3D active edge CMS pixel devices with p-type substrate has been successfully completed at SINTEF. In this paper, we study the expected post-irradiation behaviors of these devices with simulations and, after a brief description of their fabrication, we report the first leakage current measurement results as performed on wafer.
Published in:
Ieee Transactions on Nuclear Science 57,5 (2010) 2897-2905;
Link to original published article:
http://dx.doi.org/10.1109/tns.2010.2053720
Date of Version
October 2010
Recommended Citation
Koybasi, O.; Bortoletto, D.; Hansen, T. E.; Kok, A.; Hansen, T. A.; Lietaer, N.; Jensen, G. U.; Summanwar, A.; Bolla, G.; and Kwan, S. W. L., "Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for
the Super-LHC" (2010). Department of Physics and Astronomy Faculty Publications. Paper 1273.
https://docs.lib.purdue.edu/physics_articles/1273