Intrinsic Reliability Improvement in Biaxially Strained SiGe p-MOSFETs
Date of this Version
12-6-2010Citation
IEEE Electron Device Letters ( Volume: 32, Issue: 3, March 2011 )
Abstract
In this letter we not only show improvement in the performance but also in the reliability of 30nm thick biaxially strained SiGe (20%Ge) channel on Si p-MOSFETs. Compared to Si channel, strained SiGe channel allows larger hole mobility (μh) in the transport direction and alleviates charge flow towards the gate oxide. μh enhancement by 40% in SiGe and 100% in Si-cap SiGe is observed compared to the Si hole universal mobility. A ~40% reduction in NBTI degradation, gate leakage and flicker noise (1/f) is observed which is attributed to a 4% increase in the hole-oxide barrier height (φ) in SiGe. Similar field acceleration factor (Γ) for threshold voltage shift (ΔVT) and increase in noise (ΔSVG) in Si and SiGe suggests identical degradation mechanisms.
Discipline(s)
Electrical and Electronics
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Comments
S. Deora, A. Paul, R. Bijesh, J. Huang, G. Klimeck, G. Bersuker, P. D. Krisch, R. Jammy. Intrinsic Reliability Improvement in Biaxially Strained SiGe p-MOSFETs IEEE Electron Device Letters ( Volume: 32, Issue: 3, March 2011 ) doi: 10.1109/LED.2010.2099101