Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization

Author

• Kwan Seop Lim, Birck Nanotechnology Center, Bindley Bioscience Center, School of Electrical and Computer Engineering, Weldon School of Biomedical Engineering, Purdue University; ERC for Advanced Bioseparation Technology, Inha UniversityFollow
• Woo-Jin Chang, ERC for Advanced Bioseparation Technology, Inha University
• Yoon-Mo Koo, ERC for Advanced Bioseparation Technology and Department of Biological Engineering, Inha University
• Rashid Bashir, Birck Nanotechnology Center, Bindley Bioscience Center, School of Electrical and Computer Engineering, and Weldon Schol of Biomedical Engineering, Purdue UniversityFollow

Abstract

We have developed a reliable fabrication method of forming micron scale metal patterns on poly(dimethylsiloxane) (PDMS) using a pattern transfer process. A metal stack layer consisting of Au–Ti–Au layers, providing a weak but reliable adhesion, was deposited on a silicon wafer. The metal stack layer was then transferred to a PDMS substrate using serial and selective etching. We demonstrate that features as small as 2 mm were reliably transferred on to the PDMS substrate for use as interconnects and electrodes for biosensors and flexible electronics application.

Comments

DOI: 10.1039/b514755g

Date of this Version

3-10-2006

Recommended Citation

Lim, Kwan Seop; Chang, Woo-Jin; Koo, Yoon-Mo; and Bashir, Rashid, "Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization" (2006). Birck and NCN Publications. Paper 27.
https://docs.lib.purdue.edu/nanopub/27