Enhanced Thermal Contact Conductance Using Carbon Nanotube Array Interfaces

Abstract

Heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied experiementally using a reference calorimeter testing rig in a vacuum environment with infrared temperature measurements. Arrays of multiwalled CNTs are grown directly on silicon substrates with microwave plasma-enhanced chemical vapor deposition. Iron and nickel were used as CNT catalysts. CNT arrays grown under differnt synthesis conditions exhibit different pressure-contact conductance characteristics. The thermal contact resistance of CNTs with a copper interface exhibits promising results with a minimum value of 19.8 mm^2K/W at a pressure of 0.445 MPa.

Comments

DOI: 10.1109/TCAPT.2006.875876

Keywords

Carbon nanotubes (CNTs), enhanced thermal contact conductance, microwave plasma enhanced chemical vapor deposition (PECVD)

Date of this Version

6-1-2006

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