Abstract

The authors report on an Al2O3 gate oxide deposited on n-type GaN by atomic layer deposition technique. The high-frequency C-V characteristic shows deep-depletion behavior at room temperature due to the wide band gap semiconductor nature of GaN. Systematic photoassisted C-V measurements demonstrate the importance of postdeposition-annealing process which could improve the average interface trap density D-it of (1-2)x10(12)/cm(2) eV on the as-grown films to 7x10(10)/cm(2) eV on the same films after 800 degrees C rapid thermal annealing in a N-2 ambient. The high-frequency C-V technique or Terman technique is also applied to estimate the mid-gap D-it and compare to the results from photoassisted C-V technique.

Citation

APPLIED PHYSICS LETTERS 90, 143504 2007

Date of this Version

April 2007

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