Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelectric Module
Abstract
The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.
Citation
Minimizing thermally induced interfacial shearing stress in a thermoelectric module Amirkoushyar Ziabari; Ephraim Suhir; Ali Shakouri Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on Year: 2012 Pages: 1 - 4
Date of this Version
9-25-2012
Recommended Citation
Ziabari, Amirkoushyar; Suhir, Ephraim; and Shakouri, Ali, "Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelectric Module" (2012). Birck and NCN Publications. Paper 1272.
https://docs.lib.purdue.edu/nanopub/1272