Investigation of microstructure and mechanical properties of CP–Ti/Q345 filled with Cu-based wires

Author

Min Zhang, Xi’an University of TechnologyFollow
Qiaoling Chu, Xi’an University of TechnologyFollow
Jihong Li, Xi’an University of Technology
Qingyang Fan, Xi’an University of Technology
Weiwei Xie, Xi’an University of Technology

Keywords

intermetallics, welding, microstructure, mechanical

Presentation Type

Oral Presentation

Recommended Citation

Zhang, Min; Chu, Qiaoling; Li, Jihong; Fan, Qingyang; and Xie, Weiwei, "Investigation of microstructure and mechanical properties of CP–Ti/Q345 filled with Cu-based wires" (2016). The 8th International Conference on Physical and Numerical Simulation of Materials Processing. 15.
https://docs.lib.purdue.edu/icpns/2016/session4weldingandcoating/15