Wetting and interfacial microstructure of porous Si3N4/Si3N4 joint after silver metallization

Author

Yanli Zhuang, Harbin Institute of TechnologyFollow
Tiesong Lin, Harbin Institute of TechnologyFollow
Shengjin Wang, Harbin Institute of TechnologyFollow
Peng He, Harbin Institute of TechnologyFollow
Dusan P. Sekulic, University of KentuckyFollow
Dechang Jia, Harbin Institute of TechnologyFollow
Hongmei Wei, Harbin Institute of TechnologyFollow

Keywords

porous Si3N4, silver metallization, wetting, interface

Presentation Type

Oral Presentation

Recommended Citation

Zhuang, Yanli; Lin, Tiesong; Wang, Shengjin; He, Peng; Sekulic, Dusan P.; Jia, Dechang; and Wei, Hongmei, "Wetting and interfacial microstructure of porous Si3N4/Si3N4 joint after silver metallization" (2016). The 8th International Conference on Physical and Numerical Simulation of Materials Processing. 10.
https://docs.lib.purdue.edu/icpns/2016/session4weldingandcoating/10