MHD modeling of a copper slag cleaning process

Author

Hongkun Yang, Central Institute of Engineering, Electronics and Analytics (ZEA) – Engineering and Technology (ZEA-1)Follow
Jörg Wolters, Central Institute of Engineering, Electronics and Analytics (ZEA) – Engineering and Technology (ZEA-1)
Helmut Soltner, Central Institute of Engineering, Electronics and Analytics (ZEA) – Engineering and Technology (ZEA-1)
Phillip Pischke, RWTH Aachen University
Sven Eckert, HZDR
Jochen Fröhlich, TU Dresden

Keywords

collision model, copper slag cleaning, MHD, non-ferrous metallurgy

Presentation Type

Oral Presentation

Recommended Citation

Yang, Hongkun; Wolters, Jörg; Soltner, Helmut; Pischke, Phillip; Eckert, Sven; and Fröhlich, Jochen, "MHD modeling of a copper slag cleaning process" (2016). The 8th International Conference on Physical and Numerical Simulation of Materials Processing. 20.
https://docs.lib.purdue.edu/icpns/2016/session2solidificationandcasting/20