Numerical modeling of wave soldering
Abstract
A commercial CFD code, FLOW-3D, is adapted to model the flow of solder around a printed circuit board during the wave soldering process. A method to model the flow of solder through the nozzle of the solder machine and the flow of solder around a component is presented. The movement of the component through the wave is achieved by holding the component stationary and moving the wave past the component. Changes are made in the boundary conditions and a new boundary condition developed to model the movement of the wave. Simulation of the wave soldering of a single component on a coarse grid showed the surface tension model would not allow the formation of a fillet at equilibrium shape. Analysis of the formation of a fillet in three dimensions showed the method could not describe the formation of an equilibrium shape of solder without an exceptionally fine grid. This was due to the strong surface tension forces creating unbalanced accelerations and high velocities in the fluid. A promising method to damp the velocities created by the surface tension forces was utilized to show how the formation of a fillet could be approximated. A technique to model the last stages of the movement of solder past the component is presented. Used in conjunction with the velocity damping model, the technique shows promise as a method of analyzing the interaction of the wave and fillet during the final stages of wave soldering.
Degree
Ph.D.
Advisors
McDonald, Purdue University.
Subject Area
Mechanical engineering
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