Stretchable interconnects using room temperature liquid alloy on elastomeric substrate

Hyun-Joong Kim, Purdue University

Abstract

Stretchable interconnects have recently attracted considerable interest for flexible/conformal electronics such as display, sensitive skin, and wearable electronics. These applications require building active electronics on flexible substrates, which can deform into arbitrary shapes, and stretchable interconnects that can sustain large and repeated mechanical strain (stretching, bending and twisting). The ultimate goal of stretchable interconnects is to maximize multi-axial stretchability while keeping stable electrical connection and minimizing resistance variations. Some research groups have reported innovative technologies to achieve these requirements, however, those methods provide limited stretchability and employ complicated fabrication techniques. In this thesis, two different methodologies are presented to realize stretchable interconnects having large strain tolerance capability. These are (1) biaxial stretchable interconnect with liquid-alloy-covered joints on PDMS substrate and (2) multiaxial stretchable interconnect using liquid-alloy-filled elastomeric micro-channels. Resistance variation vs. strain is measured and analyzed to show the performance of stretchable interconnects. As demonstrative applications, commercialized active electronics (inverter and LED) are integrated onto the elastomeric substrate with stretchable interconnects and characterized through repeated application of mechanical strain such as stretching, bending, and twisting.

Degree

Ph.D.

Advisors

Ziaie, Purdue University.

Subject Area

Electrical engineering

COinS