Fabrication and Implementation of Flexible Electronics Based on Modern Printing Technologies
Abstract
In the last decade, the information technology industry shifted its focus from personal computing devices to mobile computing devices. The benefit offered from information technologies is more accessible than ever. In recent years, mobile computing devices have been developed further due to the high-demand from the market. The trend has led to the evolution of mobile computing devices, with huge diversification towards wearable devices, implantable devices and flexible electronics. Aligned with such applications, this thesis focuses on flexible electronics and its fabrication technologies. In this context, several implementations are demonstrated. The first is an integration technology for embedding conventional rigid components and conventional chips into flexible substrate and using modern printing technologies to integrated the circuit with other components. The prototype exhibits good performance for dc and high-speed ac signals. It also shows outstanding flexibility, good durability and reliability. The fabrication process is simple and is designed to suit large-scale manufacturing processes. Next, a thin-film field-effect transistor technology using solution-based materials has been demonstrated. The materials used for the technology show excellent performance despite being implemented with solution-based techniques. Advantages of these materials and their potential for flexible electronic applications are explored. The materials have been process using a unique fabrication method, which may lead to low cost high performance and reliable flexible electronics.
Degree
M.Sc.
Advisors
Shakouri, Purdue University.
Subject Area
Design|Packaging|Electrical engineering|Industrial engineering|Sustainability
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