Defect-free Interfacial Debonding Process for Producing Wafer-free Thin Film Nanoelectronics

Dae Seung Wie, Purdue University

Abstract

This research introduce a simple technique to physically separate a large-scale integrated circuit from the native fabrication wafer by utilizing a controlled interfacial debonding process in a defect-free manner. The ‘wafer-free’ thin film system can be then pasted onto an arbitrary place of interest, which enables the target surface to provide desired electronic functionalities. This approach is versatile to incorporate dissimilar kinds of single-crystal semiconductor nanomaterials into the system in either homogeneous or heterogeneous layout, allowing to yield high-performance nanoelectronics. Detailed experimental and computational studies reveal the underlying mechanism of the defect-free interfacial debonding process and provide a quantitative guidance to improve the manufacturability in terms of scalability, controllability, and reproducibility. System-level demonstrations illustrate the utility of this methodology in the construction of thin film nanoelectronics of logic gates, switches, and sensors on a wide range of unusual substrates such as wood blocks, glass windows, and paper stickers to endow the surface with smart functions.

Degree

M.S.M.E.

Advisors

Lee, Purdue University.

Subject Area

Engineering|Mechanical engineering

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