Impact of Squeezing on the Microstructure of Thermal Interface Materials

Authors

R. Kantharaj
C. Wassgren
A. Morris
A. M. Marconnet

Date of this Version

5-1-2021

DOI

https://doi.org/10.1109/ITherm51669.2021.9503232

Published in:

R. Kantharaj, C. Wassgren, A. Morris, A. Marconnet, Impact of Squeezing on the Microstructure of Thermal Interface Materials, 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 1241–1249, 2021.