Exploiting Microscale Roughness on Hierarchical Superhydrophobic Copper Surfaces for Enhanced Dropwise Condensation

Authors

X. Chen, Purdue University
J A. Weibel, Purdue UniversityFollow
S V. Garimella, Purdue UniversityFollow

Keywords

Superhydrophobic surface, hierarchical roughness, copper substrate, dropwise condensation, droplet departure

Date of this Version

2015

DOI

DOI: 10.1002/admi.201400480

Link to original published article:

X. Chen, J. A. Weibel and S. V. Garimella, “Exploiting Microscale Roughness on Hierarchical Superhydrophobic Copper Surfaces for Enhanced Dropwise Condensation,” Advanced Materials Interfaces, 1400480, 2015.