Fabrication and characterization of metal-molecule-silicon devices

Adina Scott, Purdue University - Birck Nanotechnology Center
David B. Janes, Purdue University
Chad Risko, Department of Chemistry, Northwestern University
Mark A. Ratner, Department of Chemistry, Northwestern University

Date of this Version

July 2007

Citation

APPLIED PHYSICS LETTERS 91, 033508 2007

This document has been peer-reviewed.

 

Abstract

Metal-molecule-silicon (MMSi) devices have been fabricated, electrically characterized, and analyzed. Molecular layers were grafted to n and p+ silicon by electrochemical reduction of para-substituted aryl-diazonium salts and characterized using standard surface analysis techniques; MMSi devices were then fabricated using traditional silicon (Si) processing methods combined with this surface modification. The measured current-voltage characteristics were strongly dependent on both substrate type and molecular head group. The device behavior was analyzed using a qualitative model considering semiconductor depletion effects and molecular dipole moments and frontier orbital energies.

 

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