Observation of Coulomb repulsion between Cu intercalants in CuxBi2Se3

Chris Mann, University of Texas at Austin
Damien West, Rensselaer Polytechnic Institute
Ireneusz Miotkowski, Purdue University
Yong P. Chen, Purdue University, Birck Nanotechnology Center
Shengbai Zhang, Rensselaer Polytechnic Institute
Chih-Kang Shih, University of Texas at Austin

Date of this Version





This is the Publisher PDF of Mann, C; West, D; Miotkowski, I; Chen, YP; Zhang, S; and Shih, C-K. "Observation of Coulomb repulsion between Cu intercalants in CUxBi2Se3." Physical Review B, 89: 155312. 2014. Copyright APS, available at http://dx.doi.org/10.1103/PhysRevB.89.155312.


Using scanning tunneling microscopy and ab initio simulations, we have identified several configurations for Cu dopants in CuxBi2Se3, with Cu intercalants being the most abundant. Through statistical analysis, we show strong short-range repulsive interactions between Cu intercalants. At intermediate range (>5 nm), the pair distribution function shows oscillatory structure along the < 10 (1) over bar > directions, which appear to be influenced by different diffusion barriers along the < 10 (1) over bar > and < 2 (1) over bar(1) over bar > directions.


Nanoscience and Nanotechnology