Heat Transfer in Trapezoidal Microchannels of Various Aspect Ratios

John P. McHale, Birck Nanotechnology Center, Purdue University
Suresh V. Garimella, Birck Nanotechnology Center, Purdue University

Date of this Version



Heat transfer in the thermal entrance region of trapezoidal microchannels is investigated for hydrodynamically fully developed, single-phase, laminar flow with no-slip conditions. Three-dimensional numerical simulations were performed using a finite-volume approach for trapezoidal channels with a wide range of aspect ratios. The sidewall angles of 54.7° and 45° are chosen to correspond to etch-resistant planes in the crystal structure of silicon. Local and average Nusselt numbers are reported as a function of dimensionless length and aspect ratio. The effect of Prandtl number upon the thermal entrance condition is explored. The fully developed friction factors are computed and correlated as a function of channel aspect ratio. Correlations are also developed for the local and average Nusselt numbers in the thermal entrance region as a function of a dimensionless axial length variable.


Nanoscience and Nanotechnology