Heat Transfer in Trapezoidal Microchannels of Various Aspect Ratios
Date of this Version1-15-2010
Heat transfer in the thermal entrance region of trapezoidal microchannels is investigated for hydrodynamically fully developed, single-phase, laminar flow with no-slip conditions. Three-dimensional numerical simulations were performed using a finite-volume approach for trapezoidal channels with a wide range of aspect ratios. The sidewall angles of 54.7° and 45° are chosen to correspond to etch-resistant planes in the crystal structure of silicon. Local and average Nusselt numbers are reported as a function of dimensionless length and aspect ratio. The effect of Prandtl number upon the thermal entrance condition is explored. The fully developed friction factors are computed and correlated as a function of channel aspect ratio. Correlations are also developed for the local and average Nusselt numbers in the thermal entrance region as a function of a dimensionless axial length variable.
Nanoscience and Nanotechnology