A 600 Degrees C Wireless Multimorph-Based Capacitive MEMS Temperature Sensor for Component Health Monitoring

S. Scott, Birck Nanotechnology Center, Purdue University
M. Scuderi, Birck Nanotechnology Center, Purdue University
Dimitrios Peroulis, Birck Nanotechnology Center, Purdue University

Date of this Version



IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS): 29 Jan.-2 Feb. 2012. S. Scott, M. Scuderi, D. Peroulis


This paper presents the design and fabrication of a new packaged MEMS capacitive temperature sensor for engine component health-monitoring applications and measurement results above 500-600 degrees C. The multimorphs employed are thermal-SiO2/LPCVD-Si3N4/sputtered-Au beams designed for deflection at these temperatures. The mean initial capacitance of the sensors is 6.441 pF; with a standard deviation of 0.197 pF. The robust fabrication process and packaging yield consistent capacitance-temperature profiles from device-to-device. Similarly, the devices exhibit a consistently-high measured average quality factor of 1,727 with a standard deviation of 54 for 5 packaged devices. Also presented are laser confocal microscope profiles from the thermal-annealing process, detailing the break-in period, after which no additional creep is observed, even after over 24 hours at 650 degrees C. This is a first-of-its-kind MEMS sensor with unparalleled performance for harsh-environment wireless temperature sensing.


Nanoscience and Nanotechnology