Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelectric Module
Date of this Version9-25-2012
Minimizing thermally induced interfacial shearing stress in a thermoelectric module Amirkoushyar Ziabari; Ephraim Suhir; Ali Shakouri Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on Year: 2012 Pages: 1 - 4
The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.
Nanoscience and Nanotechnology