Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

Stephen L. Hodson, Birck Nanotechnology Center, Purdue University
Thiruvelu Bhuvana, Birck Nanotechnology Center, Purdue University; Indian Institute of Science, Bangalore
Baratunde A. Cola, Georgia Institute of Technology
Xianfan Xu, Birck Nanotechnology Center, Purdue University
G. U. Kulkarni, Indian Institute of Science, Bangalore
Timothy S. Fisher, Birck Nanotechnology Center, Purdue University

Abstract

Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC(16)H(35))(2), to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250 degrees C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm(2) K/W and 5 mm(2) K/W, respectively. [DOI: 10.1115/1.4004094]

Discipline(s)

Nanoscience and Nanotechnology