Abstract
This paper presents recent advances in a number of novel, high-performance cooling techniques for emerging electronics applications Critical enabling thermal management technologies covered include microchannel transport and micropumps, jet impingement, miniatur flat heat pipes, transient phase change energy storage systems, piezoelectric fans, and prediction of interface contact conductance. (c) 2005 Elsevier Ltd. All rights reserved.
Date of this Version
11-1-2006
COinS