Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 produced by a laser-interference setup that would theoretically yield a periodicity of 1.7 mm, which is near the 1.6-2 mm structuring limit that was estimated based on thermal diffusion length scale for an 8 ns laser pulse. The results show that although the expected periodic interference structuring was not attained, the melt-induced texturing was affected by the laser-interference profile. Single-lap shear tests are performed with specimen surfaces prepared by traditional abrasion and laser interference structuring methods. Several laser processing parameters, such as the laser spot size, density, number of pulses, and raster speed were studied. Scanning electron microscope and profilometry measurements were used to characterize the processed surface microstructures. Web-like structures, which indicate widespread melting, were shown to be formed at different processing conditions. Based on the surface topologies investigated, two laser raster speeds were selected to make single-lap-joint specimens. Baseline joints were prepared by abrading joining specimens. The shear-lap strength and displacement at maximum load were shown to be higher by 16.8% and 43.8% for the laser-structured specimens than those of the baseline specimens, respectively. Moreover, the load-displacement curves indicate that the laser-structured joints are more ductile than those without laser-structuring. The increase ductility for the laser-structured joints was found to yield an increase in the energy absorbed during shear-lap testing of approximately of 80-90% over those measured for baseline joints. It is another indicator that laser-interference structuring enhanced the bonding performance of single-lap shear joints.

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H. Liu, J.A. Weibel, P. Geoghegan, A.S. Sabu, and E.A. Groll, Adhesive bonding of copper prepared by laser-interference near the interference structuring limits, Materials 14, p. 3485, 2021.