Title

Comparison of Equivalent System Mass of Yeast and Flat Bread Systems

Abstract

The Equivalent System Mass (ESM) metric developed by NASA describes and compares individual system impact on a closed system in terms of a single parameter, mass. The food system of a Mars mission may encompass a large percentage of total mission ESM, and decreasing this ESM would be beneficial. Yeast breads were made using three methods (hand & oven, bread machine, mixer with dough hook attachment & oven). Flat breads were made using four methods (hand & oven, hand & griddle, mixer with dough hook attachment & oven, mixer with dough hook attachment & griddle). Two formulations were used for each bread system (scratch ingredients, commercial mix). ESM was calculated for each of these scenarios. The objective of this study was to compare the ESM of yeast and flat bread production for a Martian surface outpost. Method (equipment) for both types of bread production was demonstrated to be the most significant influence of ESM when one equipment use was assumed. When multi-functional equipment was assumed, type of bread and formulation began influencing ESM calculations to a great extent. This data indicates the need to develop food formulations and menu options simultaneously with multi-functional equipment for minimizing the food system ESM of a Mars mission.

Description:9 pages

Comments

Included in: Proceedings of the SAE International Meeting, Vancouver BC, Canada July 7-10. Presented at International Conference On Environmental Systems, July 2003, Vancouver, BC, CANADA, Session: Food Processing

Keywords

equivalent system mass (ESM), NASA food system, wheat, bread

Date of this Version

July 2003

Identifier

ALS-NSCORT:p4

Publisher Identifier:

SAE Document Number: 2003-01-2618

Publisher

SAE International

ALS NSCORT Project Number

Project 13 - Food Processing (storage and packaging of food)

Project Lead

Lisa J. Mauer

Language

English

ALS NSCORT Series

Published Materials

Administrative Contact

Dave Kotterman, dkotter@purdue.edu

Rights

Copyright 2003 SAE International. For additional information please visit the intellectual property section of the publisher's website: http://www.sae.org/about/intelproperty/ or the publisher's home page at: http://www.sae.org

Access

This article is not available through e-pubs. To purchase a copy of this article visit: http://www.sae.org/technical/papers/2003-01-2618. This article is available on microfiche at Purdue University's Engineering Library.

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