Fabrication of conductive interconnects by Ag migration in Cu-Ag core-shell nanoparticles
Date of this Version
4-2010Citation
DOI: 10.1063/1.3364132
This document has been peer-reviewed.
Abstract
Fabrication of conductive nanoparticle films is observed in Cu-Ag core-shell nanoparticles by fast diffusion of Ag at 220 degrees C from particle surfaces, leading to the formation of sintered necks of Ag at the initial particle-particle contacts. Transmission electron microscopy showed that the necks were pure Ag and that particle surfaces away from the contacts were nearly Ag-free. The extent of neck formation is controllable by the choice of initial Ag thickness. Analysis of the thermodynamics of the Ag-Cu system and the relative diffusivities of Ag and Cu provide criteria for fabrication of other core-shell two-phase systems by the same mechanism.
Discipline(s)
Engineering | Nanoscience and Nanotechnology