Characterization of evaporation and boiling from sintered powder wicks fed by capillary action

Justin A. Weibel, Purdue University - Main Campus
Suresh Garimella, School of Mechanical Engineering
Mark T. North, Thermacore Inc.

Date of this Version

9-2010

Citation

DOI: 10.1016/j.ijheatmasstransfer.2010.05.043

This document has been peer-reviewed.

 

Abstract

The thermal resistance to heat transfer into the evaporator, section of heat pipes and vapor chambers plays a dominant role in governing their overall performance. It is therefore critical to quantify this resistance for commonly used sintered copper powder wick surfaces, both under evaporation and boiling conditions. The objective of the current study is to measure the dependence of thermal resistance on the thickness and particle size of such surfaces. A novel test facility is developed which feeds the test fluid, water, to the wick by capillary action. This simulates the feeding mechanism within an actual heat pipe, referred to as wicked evaporation or boiling. Experiments with multiple samples, with thicknesses ranging from 600 to 1200 mu m and particle sizes from 45 to 3551 mu m demonstrate that for a given wick thickness, an optimum particle size exists which maximizes the boiling heat transfer coefficient. The tests also show that monoporous sintered wicks are able to support local heat fluxes of greater than 500 W cm(-2) without the occurrence of dryout. Additionally, in situ visualization of the wick surfaces during evaporation and boiling allows the thermal performance to be correlated with the observed regimes. It is seen that nucleate boiling from the wick substrate leads to substantially increased performance as compared to evaporation from the liquid free surface at the top of the wick layer. The sharp reduction in overall thermal resistance upon transition to a boiling regime is primarily attributable to the conductive resistance through the saturated wick material being bypassed. (C) 2010 Elsevier Ltd. All rights reserved.

Discipline(s)

Engineering | Nanoscience and Nanotechnology

 

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