Oxygen plasma exposure effects on indium oxide nanowire transistors

Seongmin Kim, Birck Nanotechnology Center, Network for Computational Nanotechnology, Purdue University
Collin Delker, Birck Nanotechnology Center, Purdue University
Pochiang Chen, University of Southern California
Chongwu Zhou, University of Southern California
Sanghyun Ju, Kyonggi University
David B. Janes, Birck Nanotechnology Center, Network for Computational Nanotechnology, Purdue University

Date of this Version

3-16-2010

This document has been peer-reviewed.

 

Abstract

In2O3 nanowire transistors are fabricated with and without oxygen plasma exposure of various regions of the nanowire. In two-terminal devices, exposure of the channel region results in an increased conductance of the channel region. For In2O3 nanowire transistors in which the source/drain regions are exposed to oxygen plasma, the mobility, on–off current ratio and subthreshold slope, are improved with respect to those of non-exposed devices. Simulations using a two-dimensional device simulator (MEDICI) show that improved device performance can be quantified in terms of changes in interfacial trap, shifts in fixed charge densities and the corresponding reduction in Schottky barrier height at the contacts.

Discipline(s)

Nanoscience and Nanotechnology

 

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