Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization

Kwan Seop Lim, Birck Nanotechnology Center, Bindley Bioscience Center, School of Electrical and Computer Engineering, Weldon School of Biomedical Engineering, Purdue University; ERC for Advanced Bioseparation Technology, Inha University
Woo-Jin Chang, ERC for Advanced Bioseparation Technology, Inha University
Yoon-Mo Koo, ERC for Advanced Bioseparation Technology and Department of Biological Engineering, Inha University
Rashid Bashir, Birck Nanotechnology Center, Bindley Bioscience Center, School of Electrical and Computer Engineering, and Weldon Schol of Biomedical Engineering, Purdue University

Date of this Version

March 2006

Citation

Lab on a Chip, 2006, 6, 578-580

This document has been peer-reviewed.

 

Comments

DOI: 10.1039/b514755g

Abstract

We have developed a reliable fabrication method of forming micron scale metal patterns on poly(dimethylsiloxane) (PDMS) using a pattern transfer process. A metal stack layer consisting of Au–Ti–Au layers, providing a weak but reliable adhesion, was deposited on a silicon wafer. The metal stack layer was then transferred to a PDMS substrate using serial and selective etching. We demonstrate that features as small as 2 mm were reliably transferred on to the PDMS substrate for use as interconnects and electrodes for biosensors and flexible electronics application.

 

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