Abstract

Research needs in the field of thermal management of microelectronics and microsystems are identified, followed by a brief discussion of recent advances in solution approaches. These include novel solutions that rely on two-phase flow at the microscale, micropumps, droplet actuation on structured surfaces, passive transport in wick structures, ion-driven and piezoelectrically driven airflow, nanostructured thermal materials, and novel diagnostic tools.

Keywords

thermal management, cooling, nanotechnology, challenges, recent advances

Date of this Version

11-30-2010

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