Solution-processed soldering of carbon nanotubes for flexible electronics

K. D. M. Rao, Jawaharlal Nehru Center for Advanced Scientific Research
B. Radha, Jawaharlal Nehru Center for Advanced Scientific Research
Kyle C. Smith, Birck Nanotechnology Center, Purdue University
Timothy S. Fisher, Birck Nanotechnology Center, Purdue University; Jawaharlal Nehru Center for Advanced Scientific Research
G. U. Kulkarni, Jawaharlal Nehru Center for Advanced Scientific Research

Date of this Version

2-22-2013

Citation

K D M Rao, B Radha, K C Smith, T S Fisher and G U Kulkarni Published 28 January 2013 • 2013 IOP Publishing Ltd. Nanotechnology, Volume 24, Number 7

Abstract

We report a simple lithography-free, solution-based method of soldering of carbon nanotubes with Ohmic contacts, by taking specific examples of multi-walled carbon nanotubes (MWNTs). This is achieved by self-assembling a monolayer of soldering precursor, Pd2+ anchored to 1,10 decanedithiol, onto which MWNTs could be aligned across the gap electrodes via solvent evaporation. The nanosoldering was realized by thermal/electrical activation or by both in sequence. Electrical activation and the following step of washing ensure selective retention of MWNTs spanning across the gap electrodes. The soldered joints were robust enough to sustain strain caused during the bending of flexible substrates as well as during ultrasonication. The estimated temperature generated at the MWNT-Au interface using an electro-thermal model is similar to 150 degrees C, suggesting Joule heating as the primary mechanism of electrical activation. Further, the specific contact resistance is estimated from the transmission line model.

Discipline(s)

Nanoscience and Nanotechnology

 

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