Contributions from Thermal Challenges inNext Generation Electronic Systems (THERMES)

Keywords

Electronics cooling

Date of this Version

12-1-2002

Published in:

S. V. Garimella and Y. K. Joshi, “Contributions from Thermal Challenges in Next Generation Electronic Systems (THERMES),” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, pp. 567-568, 2002.

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